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Wendi K
@packagingeng_id
Level 1
Industrial Packaging Structural Engineer, ArtiosCAD Dieline Specialist
Indonesia
Inglese, Indonesiano
Chi sono
Structural Packaging Engineer with 12+ years at two global leaders: Asia
Pulp & Paper (APP) and Tri-Wall (Japan).
I create precise, manufacturing-ready dielines using ArtiosCAD. Whether
standard RSC boxes, complex mailers, or heavy-duty industrial packaging,
I engineer solutions ready for immediate production.
Deep expertise: Material properties (E-flute, B-flute, Triple Wall),
structural integrity, cost optimization, and international compliance
(FEFCO/ECMA).
Your packaging isn't just design—it's engineered for factory success. Fast turnaround.
Message me your specifications.
Competenze
Wendi K
offline •
Tempo di risposta medio: 5 ore
Consulta i miei servizi
Template di stampa
I will create professional artioscad dielines and 3d packaging
4 Recensioni
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1-4 di 4 recensioni
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Più rilevante
kimscopelliti
Stati Uniti
Wendi really understood what I was looking for in packaging and went the extra mile to deliver a very professional design that met my goals. I look forward to working with him again in the near future. Thank you, Wendi!
Utile?
shivismagee
Regno Unito
Risposta del venditore
Utile?
mofado77
Cliente abituale
Canada
Utile?
anasumardi
Indonesia
Perfect dieline for products with minimal height. Efficient and cost-effective.
Utile?
