r
rocconmorgan

Rocco N. Morgan

@rocconmorgan

Product Development Engineer, 3D CAD, PCB Design And Premium Packaging

Stati Uniti
Inglese, Spagnolo, Francese
Alcune informazioni sono riportate in lingua inglese.
Chi sono
I’m a Product Development Engineer helping inventors, startups, and brands bring physical products from concept to factory-ready production. I specialize in precision 3D CAD modeling, manufacturing-ready drawings, professional circuit schematic and PCB layout design, and high-impact product packaging that stands out on shelves and online. My focus is technical accuracy, Design for Manufacturing (DFM), and visual appeal that builds buyer trust. I deliver clean, reliable results optimized for CNC, injection molding, JLCPCB, and PCBWay. Let’s turn your idea into a market-ready product.... Continua a leggere

Competenze

r
rocconmorgan
Rocco N. Morgan
offline • 
Tempo di risposta medio: 1 ora

Consulta i miei servizi

Design di packaging
I will do packaging, label and box design with premium brand appeal
A partire da55 USD / progettoMaggiori dettagli
Design per la produzione
I will do 3d cad product design and technical drawings for manufacturing
A partire da70 USD / progettoMaggiori dettagli

Portfolio

Esperienza lavorativa

Fiverr

Fiverr

Part time • 0 mos

CAD Designer & Packaging Specialist

Sep 2021 - Sep 2021 • 0 mos

Developed 3D CAD models, detailed technical drawings, and high-converting product packaging and label designs for e-commerce and retail clients. Focused on creating visually premium packaging while ensuring structural integrity and manufacturing feasibility. Supported electronics teams with basic PCB enclosure design and 3D STEP models for seamless integration. (487 characters)

Mechanical & Electronics Design Engineer

Aug 2018 - Aug 2018 • 0 mos

Designed mechanical components, enclosures, and integrated PCB layouts for consumer electronics and industrial equipment. Created production-ready 3D models, technical drawings with GD&T, and optimized designs for CNC machining, injection molding, and PCB assembly. Collaborated with manufacturing partners to ensure first-pass success and cost efficiency. Delivered multiple full product development packages from concept through prototyping.