Wes Tu

R&D Engineer

GYROBOT SYSTEM INC • Full time

Aug 2025 - Present • 1 yr

I apply a rigorous R&D mindset to master AGV system architectures, focusing on ROS-based applications. Global Deployment: Led AGV implementation for high-profile clients including Intel (Arizona) and PTI (Taiwan). System Optimization: Configured LiDAR safety parameters, navigation paths, and docking stations for optimal fleet performance. Customer Success: Delivered technical training to diverse client teams, ensuring high system adoption and satisfaction. Cross-functional Collaboration: Collaborated with the R&D department to refine software logic and hardware durability based on real-world field data.

R&D Engineer

Grenergy • Full time

Feb 2024 - Present • 2 yrs 6 mos

At Grenergy Technology, I am responsible for motor control firmware development and mechanical design. My work includes: Firmware Development: Implementing motor control firmware using the zero-crossing detection method and developing corresponding driver programs. I primarily work with CubeMX and Keil. Mechanical Design: Designing new motor mechanisms and maintaining existing mechanical designs. Currently, I am leading the mechanical design for a new drone project. Patent Management: Patent search and maintaining existing patents. I made a bold career shift to become a firmware engineer, embracing the challenge of electromechanical integration. This role allows me to bridge firmware and mechanical design, contributing to innovative motor control solutions.

Mechanical Engineer

SAULTECH TECHNOLOGY CO • Full time

Oct 2021 - Feb 2024 • 2 yrs 4 mos

As a member of the Semiconductor Development Department, I played a key role in leading Saultech Technology’s transformation through the following contributions: Product Ownership – CL10: Served as the product owner of CL10, the world’s first semiconductor chip cleaning machine. I independently designed the mechanism and process layout, conducted verification experiments for key modules, applied for related invention patents, and coordinated with various departments to finalize the machine. Infrared Detection Module – IN10: Led the design, assembly, power distribution, testing, and adjustment of IN10, a bonding detection module utilizing infrared light penetration for wafer inspection. I also selected the appropriate optical components to optimize performance. Particle Detection System: Designed an optical path that effectively combines laser light and a photomultiplier tube (PMT) to detect particles with high precision. Motion Animation Development: Independently created motion animations of a die bonder for the company's semiconductor exhibition booth to showcase machine functionality. Calibration & Patent Documentation: Completed calibration procedures and assisted in the preparation of patent documents for various semiconductor machines. Machine Design & Assembly: Carried out modification design and assembly for other semiconductor machines, improving their performance and functionality. Through these experiences, I have developed expertise in semiconductor equipment design, optical system integration, and mechanical engineering, contributing to the advancement of cutting-edge semiconductor technologies.